电子芯片封装实验室/微波暗室
Introduction of Electronic chip packaging laboratory
Microwave Anechoic Chamber
电子封装是集成电路芯片生产完成后不可缺少的一道工序，对芯片的质量和竞争力有极大的影响。芯片封装将裸片放在基板上，引出引脚，固定包装成为一个整体，具有保护芯片、增强性能等作用。芯片封装的基本工艺流程包括磨片、硅片切割、芯片粘接、固化、引线焊接、注塑激光打字、模后固化、电镀、切筋成型等步骤。
微波暗室是采用吸波材料和金属屏蔽层组建的特殊房间，主要用途是模拟自由空间，进行天线远、近场测试,避免杂波干扰、提高被测的精准度和效率。
本实验室负责模拟、射频集成电路、微波电路与天线等方向的研究、设计、封装、测试等工作。
本实验室隶属电子科学与技术专业实验室，承担电子科学与技术、电子信息工程和通信工程等专业的课程实验任务，承担模拟集成电路设计、射频集成电路电路设计、射频微波电路与天线设计等方向的相关实训、实践任务，并作为本科生、研究生的竞赛实践基地和教师部分课题研究基地等。
主要开发软件有：Cadence、ADS、HFSS等
主要测试设备和仪器有：示波器、矢量网络分析仪，矢量信号源，频谱分析仪等。
本实验室相关课程和方向有：集成电路设计与原理，集成电路测试技术、集成电路工艺、射频通信电路，微波技术与天线等。
Electronic packaging is an important process after the production of integrated circuit chip, which has a great impact on the quality and competitiveness of the chip. Chip packaging puts the die on the substrate, leads out the pins, and fixes the chip as a whole, which can protect the chip and enhance the performance. The basic process of chip packaging includes back grinding, wafer saw, die attach, epoxy cure, wire bond, molding, laser mark, plating, trim, form and so on.
Anechoic chamber is a special room made up of absorbing material and metal shield layer, which is applied to test near and far field characteristics of antenna in simulated free space, avoid interference, and improve the accuracy and efficiency of the measurement results.
The laboratory is utilized for research, design, packaging, and test in the areas including analog integrated circuit, RF integrated circuit, microwave circuit and antenna.
This laboratory is subordinate to the major of Electronic Science and Technology, undertaking the experimental tasks of the Department of Electronic Science and Technology, the Department of Electronic Information Engineering, and the Department of Communication Engineering. It can also be used for the practical training and electronic competition practicing bases for undergraduates and postgraduates and the research bases for teachers and local governments.
Main development software: Cadence, ADS, HFSS, etc.
The main test equipments and instruments:Oscilloscope, Vector Network Analyzer, Vector Signal Generator, Spectrum Analyzer, etc.
Main Courses and majors: IC Design and Theories, IC Testing Technology, IC Process, RF Communication Circuit Design, Microwave Technology And Antenna, etc.
